MTS/Principal Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

About GF

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity, and sustainability. For more information, visit www.gf.com .

Introduction:

Globalfoundries Singapore is seeking highly skilled and motivated Experienced Member of Technical Staff (MTS)/Principal Process Engineer, to become part of our starting 300mm Advance Packaging Center, Singapore.

The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging related process (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level), do troubleshooting for process and tool issues. Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.

Job Responsibilities:

Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. process stability, cost of ownership) targets.

Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance and tool matching. Understand the concept of repeatability and reproducibility (R&R) run.

Improve process robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.

To work closely with equipment team to improve equipment productivity indices

Resolve complex technical issues in own Module or yield related issues.

Support the Integration team and Quality organization to ensure technology meet the qualification and reliability requirements.

Sustain and improve process / SPC to meet quality, cost, productivity requirements

To coach and develop other engineers on advance packaging Etch processes knowledge.

Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Related manufacturing and development experience is requested.

Required Qualifications:

BS degree or Master's Degree or PhD in Electrical Engineering, Material Science & Engineering, Chemical Engineering, Physics, or other relevant engineering discipline is required

4+ (PhD), 6+ (MSc), 8+ (BSc) years working experience in advanced packaging industry

Required experience of Leading Fab wide cross modules process development and projects coordination. Hands-on experience in advanced packaging (Si interposer, D2W, W2W) process tools.

Excellent verbal and written communication skills.

Strong interpersonal skills and ability to work effectively with different cultures.

Conduct regular meetings with PI & UMD for knowledge learning, with yearly projects that improve quality, cost, yield, or productivity. Cost reduction

Take charge of group development and needs

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