RF Device Modeling Engineer

• Description
• About TI

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000+ customers transform the future today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!

About the Job

Join TI's elite SPICE Modeling Group and drive cutting-edge semiconductor innovation. You'll extract and optimize compact (SPICE) models for next-generation devices while collaborating with world-class engineers across analog, digital, and mixed-signal design and process technology teams.

Location: Bangalore, India

What You'll Do:

Extract compact models for advanced semiconductor devices (HBT/BJT, RF CMOS, RF Passives, GaN)

Partner with designers and technologists to deploy modeling solutions for breakthrough RF circuit topologies and drive design-technology co-optimization

Develop innovative model formulations for emerging device technologies

Automate modeling infrastructure to accelerate technology development

Develop AI/ML-enhanced models and parameter extraction methodologies

Validate models through comprehensive measurement and analysis

The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.

Why This Role Matters:

Your modeling expertise will directly impact TI's next-generation products, from automotive to industrial to embedded applications. You will work at the intersection of process, device physics, and circuit design, solving complex challenges and delivering cutting edge solutions.

Ready to model the future? Apply today.

• Qualifications
• Minimum requirements:

Ph.D./Masters in Electrical Engineering or related field

5+ years in compact (SPICE) RF modeling for HBT/BJT and CMOS

Preferred qualifications:

Expert-level experience with RF characterization, modeling, and circuit-level validation for s-parameters, noise figure, linearity, IMP3/IP3, and harmonic distortion

Strong understanding of RF test-structures, layouts, and calibration/de-embedding techniques

Experience with models (BSIM, MEXTRAM, HICUM, MVSG-GAN, ASM) and parameter extraction tools (ICCAP, BSIMPROPLUS, MBP, etc.)

Deep understanding of semiconductor physics and circuit analysis

Proficiency in EDA tools (Cadence), SPICE simulators (Spectre) and Verilog-A

Programming skills in MATLAB/Python

Strong data analysis skills with AI/ML expertise and TCAD experience are highly valued