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Cree

Staff Engineer-Lead frame & Package Design

Ipoh, Malaysia

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hirly's read of this role

Role family
Engineering
Seniority
Lead / management
Country
MY
Work mode
On-site / unstated
First seen by hirly
30 Sept 2026

Derived automatically from the posting. Upload your resume above to see how the role scores against it.

the posting

  • Performs design-generation and reviews for new packages or platforms which includes component , sub-assembly and Package Outline for new platforms and new devices
  • Ensures that the appropriate documents are in place for all new & existing design changes in PDM
  • Participate in Assembly & Test Design Rules, Design of Manufacturing (DFM) and Feasibility studies which includes mechanical stack-up tolerancing to ensure an design is optimised for cost and manufacturability
  • Maintenance & revision of Design rules to ensure they are up to date taking into account Suppliers, equipment & Customer capabilities and requirements respectively.
  • Knowledge of semiconductor Assembly/Test manufacturing and FEA simulation is an advantage
  • Performs other functions as may be assigned from time to time by superior.

Job Specification

  • Education/Knowledge: University graduate, preferably of an Engineering course with knowledge in mechanical design(2D &3D) Software
  • Skills: Excellent Computer skills
  • Work Experience: At least 5 to 8 years in same/related field, with AutoCAD experience especially in Semiconductor Packaging & Lead frame design
Original posting on Cree's site ↗

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