Wire Bond-Manufacturing Engineer

About Lumilens

At Lumilens, we are building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Our mission is to unlock a new era of computing that is faster, cooler, and massively more efficient. Join our world-class team as we redefine possibilities in photonic technology.

Job Description

We are seeking a Wire Bond Manufacturing Engineer specializing in Process & Equipment to join our Manufacturing Engineering team within Semiconductor Assembly & Test. In this mid-to-senior level role, you will be responsible for developing, qualifying, optimizing, and sustaining wire bonding processes and equipment for semiconductor packaging operations. You will oversee process and equipment performance for ball bonding, wedge bonding, and ribbon bonding operations, ensuring high yield, reliability, and throughput, while driving continuous improvement and supporting new product introduction (NPI).

Key Responsibilities

Process Engineering

Develop, characterize, qualify, and optimize wire bond processes (thermosonic ball bonding, wedge bonding, ribbon bonding) for gold, copper, and aluminum wire systems

Establish and maintain process specifications, bond recipes, work instructions, and control plans

Lead root cause analysis and corrective/preventive actions (CAPA) for wire bond process yield losses and defects

Support NPI by developing new wire bond process flows, including DOE-driven process windows

Perform wire pull and ball shear testing; analyze results against specifications (MIL-STD-883, JEDEC)

Drive process capability (Cpk) improvements and defect reduction through SPC and structured problem-solving

Equipment Engineering

Own the uptime, throughput, and performance of wire bonding equipment (ASM, Kulicke & Soffa, Shinkawa, Hesse, etc.)

Troubleshoot and resolve equipment-related issues and optimize bonder cycle time and UPH (units per hour)

Lead equipment qualification, installation, and buy-off (IQ/OQ/PQ) for new or upgraded wire bonders

Collaborate with equipment vendors for technical escalations and upgrades

Plan preventive maintenance and spare parts strategy

Quality & Reliability

Partner with Quality and Reliability teams on failure analysis for field and customer returns

Support qualification builds, reliability testing (temp cycle, HTOL, HAST), and customer PPAP/PSW submissions

Ensure compliance with IPC/JEDEC standards and customer requirements

Cross-Functional Collaboration

Work closely with Product/Design Engineering for bond pad layout and substrate design

Partner with Process Integration, Test, and Quality to resolve yield and reliability issues

Support cost reduction initiatives and train operators/technicians on process and equipment

Documentation & Compliance

Maintain process control documents, FMEAs, control plans, and traceability as per Lumilens quality management systems (ISO 9001 / IATF 16949 / AS9100)

Support internal and customer audits related to wire bond processes and equipment

Requirements

Required:

Bachelor’s degree in Electrical, Mechanical, Materials Science, or related engineering

3–7 years’ hands-on experience in wire bond process/equipment engineering within semiconductor assembly (OSAT/IDM)

Knowledge of ball, wedge, and/or ribbon bonding processes and failure modes

Experience with DOE, SPC, and root cause/CAPA methods

Familiarity with wire bond equipment platforms (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond)

Understanding of reliability tests and industry standards (JEDEC, MIL-STD-883)

Strong analytical, troubleshooting, and cross-functional communication skills

Willingness to support shift or production floor needs

Preferred:

Experience in high-volume power semiconductor, RF/microwave, automotive, or optoelectronics packaging

Exposure to copper wire bonding and associated process/reliability considerations

Experience with fine-pitch wire bonding ( Six Sigma Green/Black Belt certification

Familiarity with statistical software (Minitab, JMP), MES/data systems, and AOI/vision systems

Cleanroom manufacturing experience

What We Offer

Competitive salary and benefits package

The opportunity to work on cutting-edge semiconductor packaging technology

A collaborative, cross-functional engineering environment

Career growth within the manufacturing/process engineering track

Lumilens is an equal opportunity employer committed to diversity and inclusion.