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NXP

Semiconductor Package Competitive Analysis Intern

Kuala Lumpur

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hirly's read of this role

Seniority
Internship
Country
MY
Work mode
On-site / unstated
First seen by hirly
27 Sept 2026

Derived automatically from the posting. Upload your resume above to see how the role scores against it.

the posting

Competitive Analysis Intern – Package Innovation

  • Role Summary
  • Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities.

Key Responsibilities

  • Perform structured data mining of competitor product releases, PCNs, teardown reports, and technology announcements
  • Develop insights on packaging trends, cost/performance positioning, and technology differentiation
  • Conduct startup and emerging technology evaluations relevant to advanced packaging
  • Consolidate findings into clear, executive-ready reports and dashboards for PI leadership
  • Maintain and enhance competitive analysis databases and tracking frameworks

Additional Exposure

Participate in ATKL manufacturing projects to gain foundational understanding of semiconductor assembly processes

Qualifications

  • Degree candidate in Materials Science, Mechanical, Electrical Engineering, or related field
  • Strong analytical mindset with ability to synthesize large datasets into actionable insights
  • Proficient in Excel and PowerPoint; data analysis or visualization experience preferred
  • Familiarity with AI tools and advanced search techniques for efficient data mining is highly desired
  • Strong communication skills with ability to clearly present findings

More information about NXP in Malaysia...

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Original posting on NXP's site ↗

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