This role has closed. SpaceX has taken the posting down.
hirly last saw it live on 17 September 2026. See similar open roles below, or browse the live board.
SpaceX
Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)
Bastrop, TX
Similar open jobs
- Sr Project Process EngineerSibelco · SP SchoolhouseFirst seen today
- Advanced Packaging Process Engineer III (E3)Amat · Santa Clara,CAFirst seen today
- Senior Process Engineer, OncologyBilliontoone · Menlo Park, CAFirst seen today
- Chemical Process Engineer IISolstice Advanced Materials · Bryan, TX, United StatesFirst seen today
- Vertex Spring Co-Op, Process Engineering Data AnalyticsVrtx · Boston, MAFirst seen today
- Staff Process EngineerThermofisher · Rochester, New York, USAFirst seen today
- Vertex Spring Co-Op, Process Engineering Data AnalyticsVrtx · Boston, MAFirst seen today
- Data and Process EngineerVopak · Deer ParkFirst seen today
- Process EngineerVishay · Carson City, NVFirst seen today
- Semiconductor Process EngineerMicron · Boise, ID - Main SiteFirst seen today
- Manufacturing & Tech Ops - Process Engineer III/Lead Process Engineer - Project FarmaNewperkinelmer · 7 LocationsFirst seen today
- Process EngineerHbfuller · Michigan Center, Michigan, USAFirst seen today
- Process Engineer, 2nd ShiftGeaerospace · EvendaleFirst seen today
- SMT Process Engineer 3Flextronics · USA, TX, AustinFirst seen today
- Process EngineerFlextronics · USA, TX, AustinFirst seen today
hirly's read of this role
- Seniority
- Senior
- Country
- US
- Work mode
- Remote-friendly
- First seen by hirly
- 16 Sept 2026
Derived automatically from the posting.
the posting
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
SR. SILICON PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK)
SpaceX is leveraging its experience in building rockets and spacecraft to deploy Starlink, the world’s most advanced broadband internet system. Starlink is the world’s largest satellite constellation and is providing fast, reliable internet to 4M+ users worldwide. We design, build, test, and operate all parts of the system – thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We’ve only begun to scratch the surface of Starlink’s potential global impact. As we continue to upgrade and expand the constellation, we’re looking for best-in-class engineers to join the team.
In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. We are looking for hands-on and dynamic engineers with expertise in semiconductor packaging design, process development, equipment, and test. You will assume full ownership of packaging products and process modules and take them from concept to mass production as we strive to make Starlink more affordable to those who need it most.
RESPONSIBILITIES:
Own packaging assembly processes from concept to mass production including equipment and material selection for wafer-level and chip-level systems
Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach
Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
Own packaging prototypes, product development and release to production
Select equipment and material to meet quality, reliability, cost, yield, and production targets
Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements
Cross-functional interface with IC design, materials, thermal, systems, and production teams
Implement advanced packaging solutions into SpaceX next generation products
BASIC QUALIFICATIONS:
Bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other applied engineering discipline
5+ years of professional experience in semiconductor assembly and packaging
PREFERRED SKILLS AND EXPERIENCE:
Advanced technical degree
7+ years industry experience with microelectronics packaging development
Packaging familiarity with flip-chip, BGA, fcCSP, WLCSP, fan out FO processes, system-in-package SiP, multi-chip modules MCM, panel level packaging, heterogenous and chiplet integration
Hands-on packaging, PCB, PCBA, or SMT assembly experience
OSAT (outsource semiconductor assembly and test) experience a plus
ITAR REQUIREMENTS:
To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here .
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to [email protected] .