Volantis Semiconductor, Inc.
Photonics Packaging Engineer
Hybrid Remote/SF Bay Area/Austin/Boston
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hirly's read of this role
- Seniority
- Mid level
- Country
- US
- Work mode
- Remote-friendly
- First seen by hirly
- 3 Oct 2026
Derived automatically from the posting. Upload your resume above to see how the role scores against it.
the posting
What We're Looking For:
We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages.
This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.
Ideal Background:
Experience with integrated photonics package assemblies with multiple dies
Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Nice to Have:
Experience with large device count photonic assemblies
Experience with clear underfill
Experience with high density fiber attach
Experience with large substrate size photonic MCM assemblies
Hands-on experience with PIC design
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