Process Engineer, Chemical and Mechanical Polish (CMP)

Description

General Function:

The Chemical and Mechanical Polish (CMP) Process Development Engineer is responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications. The CMP Process Development Engineer must have a very hands-on mindset and be an excellent communicator. Furthermore the candidate must have an engineering degree (MS or PhD) and a broad knowledge in either Electrical Engineering, Material & Science or Chemistry.

This is a rare opportunity to develop Semiconductor Engineering skills with a highly motivated, high performance technical team on highly differentiated, and disruptive technologies.

Position’s Purpose:

The candidate will provide technical and sustaining engineering support in both development and manufacturing areas. The CMP Process Development Engineer will also recommend and implement equipment and process modifications to improve production efficiencies, manufacturing techniques or production yields for existing products.

The candidate will develop and conduct statistical analysis, such as Design of Experiments (DOE) or Statistical Process Control (SPC), targeting physical cause of failure for yield loss and improving quality. The CMP Process Development Engineer will interact with Senior Process Development Engineers, Product Design and Process Integration personnel to ensure that processes and designs are compatible.

Over a short period of time, the candidate must have the ability to develop a strong understanding of all major process modules (mostly in Cu polish, Ta polish, W polish, Glass polish, SiO2 Polish, Si and amorphous polish, and polyimide polish, including post polish slurry surface cleaning with either system integrated wafer scrubbers and off-line wafer scrubbers, etc).

The CMP Process Development Engineer must also be able to understand and protect both customer and Skorpios IP while simultaneously developing new IP. The candidate is expected to work collaboratively with Skorpios’ Integration team, Operations team, Maintenance team, and Development team in order to execute project plans and complete company deliverables.

Requirements

Key Tasks, Duties and Responsibilities:

30% Work closely with Senior Integration Engineers, Customers, and Other Development Engineers to execute experiments, and adjust or optimize processes during our 24/7 Fab Operation. Partner with Product Engineering and Integration to help ensure effective new products and process introductions as well as consistent device performance and quality. Assist Process Technicians through challenging process steps. Help analyze metrology results and disposition lots based on data and pass/fail criteria. Report results to Integration Engineering Team and Process Development Engineering Team. Provide effective pass-downs to help sustain uninterrupted operations in the CMP area.

30% Sustain and improve processes for wafer fabrication. Interface equipment engineering, operation, and management to improve cycle time, tool availability, quality and product yields. Preserve working knowledge of all codes and standards applicable to assigned production equipment. Assure that the manufactured products conform to specifications and application requirements. Communicate with Senior Development Engineering team and Integration teams to resolve deviations or technical issues. Sustain existing processes in the areas of, dielectric CMP, Silicon and Amorphous Silicon CMP, Cu CMP, Ta CMP, W CMP, Polyimide CMP, and all post-CMP cleaning or scrubbing techniques required to ensure wafers are free of slurry / particles once the polish process is completed.

20% Create and maintain operating specifications for production processes and equipment. Drive innovation and continuous improvement in a fast-paced, dynamic environment.

20% Monitor process health with Statistical Process Control (SPC) and respond to out-of-control event following out-of-control action plans.

Basic Minimum Requirements:

Education and Experience:

Ph.D. or Master’s Degree in Science with emphasis/majors in the fields of Electrical Engineering, Material & Science, Physics or Chemistry. Equivalent expertise with industry related experience is also adequate for the position.

Individuals with advanced degrees and experience in a development environment are welcomed to apply.

Processing experience in a lab or a fab in the areas of Chemical and Mechanical Polish, and post-polish wafer surface cleaning is a must. Processing experience with Cu plating is a plus.

Requirements:

Willingness to work a flexible schedule in support of 24x7 manufacturing.

Strong interpersonal and communication skills.

Ability to work with minimal supervision.

Skills/Knowledge/Abilities:

Ability to work well with junior and senior level, to include Process Technicians and Engineers.

Basic understanding of algebraic concepts.

Good computer skills and familiarity with MS Office Word, Excel, and PowerPoint.

Good data extraction, analysis, and reporting skills.

Ability to troubleshoot basic problems and address root causes.

Must be able to work in a dynamic start-up environment.

Basic understanding of semiconductor processing.

Ability to understand all maintenance activity details required to ensure a healthy and repeatable process.

Ability to plan and prioritize activities, perform and monitor multiple overlapping tasks/operations to meet goals and timelines.

Requirement for strong ownership/responsiveness in a manufacturing environment, good data analysis/statistics skills and good oral/written communication skills.

Flexibility to work hands-on in the cleanroom, operate the tool when needed, write and run CMP recipes, inspect wafers under the microscope, and perform basic characterization related to CMP processing with particles / defects metrology, roughness metrology, and thickness / uniformity metrology.

Physical Requirements/Work Environment:

Successful completion of a post-offer pre-employment background check.

The job is somewhat sedentary, consisting of sitting, standing, and walking. May at times carry, push, or pull items in excess of 10 pounds.

Daily use of a computer, copy machine, telephone, and general office equipment.

Work in a cleanroom environment wearing cleanroom gowns and regular use of metrology or characterization equipment.

Other Special Requirements:

Visa sponsorship is not available.

Ability to travel less than 5%.

Why Skorpios?

At Skorpios, you will be at the forefront of the silicon photonics revolution. We offer the chance to work on truly disruptive technology that is changing how the world connects. You will be part of a team where technical excellence is celebrated and where your contributions have a direct impact on the success of our next-generation product lines.

Skorpios offers an excellent benefits package which includes:

• •Competitive Salary
• •Medical
• •Dental
• •Vision
• •401(k)
• •Company paid Life Insurance
• •Company paid Disability
• •Paid Holidays
• •Paid Vacation
• •Gym Membership Discounts

Export Control / ITAR Statement: This position is located at a facility that operates under International Traffic in Arms Regulations (ITAR). All applicants must be 'U.S. persons' within the meaning of ITAR. ITAR defines a 'U.S. person' as a U.S. Citizen, U.S. Permanent Resident (i.e., 'Green Card Holder'), Political Asylee, or Refugee.

Skorpios Technologies, Inc. is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity or expression, national origin, ancest