Product Engineer (3D IC, Heterogeneous Integration & Advanced Packaging)

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Job Title: Principal Product Engineer

Location: San Jose, California, United States

Reports to: Product Engineering Director

Job Overview:

As Product Engineer, you are responsible for driving the definition, early deployment, and broader adoption of the Cadence Virtuoso Heterogeneous Integration technologies. You work with strategic customers, Product Management, R&D, Product Validation, and Application Engineering teams to define requirements, validate solutions, and accelerate customer success in physical implementation flows for 3D IC, heterogeneous integration, and advanced packaging.

Job Responsibilities:

• •Drive, validate, and promote an end-to-end solution for system design implementation flows spanning 3D IC, heterogeneous integration and advanced packaging.
• •Partner with leading semiconductor customers to understand complex system co-design challenges and translate them into clear product specifications.
• •Produce high-quality Product Requirement Specifications (PRS), technical use cases, and support R&D throughout product development.
• •Collaborate cross-functionally with R&D, Product Management, Field teams, Technical Publications and Product Validation to deliver robust, customer-ready capabilities.
• •Create and deliver demonstration collateral, application workflows, and enablement materials to accelerate customer and field adoption.
• •Troubleshoot design-flow issues, provide technical guidance and workarounds, and drive bug/enhancement prioritization.
• •Support product launches, customer engagements, and industry events.
• •Own deliverables from definition through customer deployment with a strong focus on execution and accountability.

Job Qualifications:

• •BS in Electrical Engineering, Electronics, or a related technical field.
• •Strong experience in semiconductor design, physical implementation, advanced packaging, or EDA product engineering.
• •Strong hands-on knowledge of the Cadence Virtuoso platform and associated custom IC design flows.
• •10+ years of relevant experience, or equivalent demonstrated expertise.
• •Proven ability to work independently, prioritize effectively, and take responsibility for technical deliverables.
• •Strong verbal and written communication skills, with the ability to collaborate effectively across global and multicultural teams, and across functions.
• •Highly motivated by the rapidly evolving landscape of 3DIC, heterogeneous integration, and advanced packaging technologies, with a passion for driving innovation in next-generation semiconductor solutions.

Additional Skills/Preferences:

• •Experience with software product definition, validation, or technical marketing activities.
• •Experience with co-design flows around 3D IC, heterogeneous integration, silicon-package-board integration.
• •Knowledge of Cadence Allegro Package Designer Plus (APD+) and package implementation methodologies.
• •Knowledge of Cadence Virtuoso SKILL language or any other interpreted language.

Additional Information:

Cadence is committed to equal employment opportunity and employment equity throughout all levels of the organization. We strive to attract a qualified and diverse candidate pool and encourage diversity and inclusion in the workplace.

The annual salary range for California is $140,000 to $260,000. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.

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