ASIC Package Design Project Manager

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Job Description:

Broadcom is seeking an experienced IC Package Design Project Manager to lead a team of engineers designing complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support the engineering team with project management, and opportunities to contribute to technical methodologies.

RESPONSIBILITIES:

Create and track project plans for 20+ concurrent designs (scope, schedules, resources)

Improve scheduling methodologies and task tracking and coordination

Organize team and customer activities to keep projects on track

Communicate plans, status, next steps and risks

Create technical methodologies for package design

Steering package technology and design rules, with input from team members

Customer, vendor, and cross-functional collaboration

EDUCATION/EXPERIENCE & REQUIREMENTS:

Preferred candidates have previous experience managing package design projects

Bachelors and 12+ years of related experience; or Masters degree and 10+ years of related experience

Knowledge of package-level signal integrity and power integrity, to apply to package designs

Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

Self-management and organization skills

Technical understanding related to package design:

Package-Design lifecycle

How the substrate and package fit into the overall ASIC design and manufacturing flows

Design Data, including how it is created and used: .mcm, package spreadsheet, drawings (POD, Lid, Substrate)

DFx trade offs (Design for “x”, where is x is manufacturability, reliability, assurance of supply, SI/PI, etc)

Layout

SI/PI extractions and Simulations

Automation code development

Mechanical & Thermal modeling

Project Management

New Business Quotes

OTHER REQUIREMENTS

This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position

Occasional travel may be required

Compensation and Benefits

The annual base salary range for this position is USD To USD

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.