Design Intern 2027 - Advanced Integrated Circuits Research

At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world. In this role, you will join a world-class team of engineers and researchers and contribute to the development of innovative integrated circuits implemented in deep submicron CMOS (Complementary Metal-Oxide-Semiconductor) technologies. We focus on innovative circuit designs for a range of emering applications such as AI accelaration, high-speed communications, and chiplet-based integration approaches, among others. Specific responsibilities include: Collaborate on architecture/system-level development. This will involve the analysis of trade-offs using system simulations and/or software and may also involve the analysis of measured data from existing/prior ICs Perform design and/or synthesis of digital and/or mixed-signal circuit building blocks to meet a set of specfications Perform co-simulation and verification of the designed circuits and sub-systems Support physical design/synthesis and post-layout verification Document design concept, simulation, and verification results Have experience with relevant industry-standard IC-development tools such as Cadence Have experience with design using deep sub-micron CMOS technologies Possess a track record of success in completing complex mixed-signal and/or digital IC designs Successfully create and communicate technical ideas Knowledge of AI-accelertor architectures Knowledge of chiplet-based system implementation approaches and their assosciated communication interfaces Applied knowledge of standard-cell digital design, custom digital design, and/or mixed-signal design for high-speed communications Knowledge of common programming languages such as Python Experience with hardware-software co-design United States Research Internship Yorktown Heights, US (0147) International Business Machines Corporation