Engineer II (DB & WB)

• About the role
• This role is responsible for end-to-end ownership of both process and equipment performance for Die Bond and Wire Bond stations in a Reel-to-Reel (R2R) semiconductor assembly line. The engineer plays a critical role in ensuring high equipment uptime, process stability, yield improvement, and quality excellence in a high-volume manufacturing environment.

The position requires strong technical hands-on capability, data-driven problem solving, and close collaboration with cross-functional teams. The engineer will act as a key technical owner, driving continuous improvement, supporting new product introductions, and implementing robust controls to prevent process and equipment-related failures.

What You Will Do

Own and sustain Die Attach and Wire Bond processes and equipment, ensuring stable operation, high OEE, and compliance with process specifications.

Manage tooling setup, calibration, alignment, and qualification activities.

Provide daily process and equipment support to production lines to ensure smooth operations and lot transitions.

Conduct DOE, FMEA, and root cause analysis to resolve yield and quality issues such as die tilt, voids, ball offset, wire lift, and non-stick.

Optimize bonding parameters and validate process capability (Cpk) for new and existing products.

Lead new product introduction (NPI), including setup, conversion, and buy-off for new products and material changes.

Analyze equipment performance and process data (UPH, yield, downtime, alarms) using Spotfire, Power BI, Excel, or equivalent tools.

Drive continuous improvement and cost reduction projects to enhance productivity, reduce scrap, and improve process robustness.

Implement digital controls and interlocks (recipe management, alarm limits, auto-locks) to prevent human and equipment-related errors.

Collaborate with QA, Production, Engineering, and Design teams to ensure process reliability and customer compliance.

Document process procedures, SOPs, setup guides, and troubleshooting standards.

Provide technical training and mentoring to technicians and operators.

Prepare and present weekly reports on yield, performance, and improvement actions to management.

What You Will Need

Bachelor’s degree in engineering (Mechanical, Electrical, Electronics, Mechatronics, or related disciplines).

2–3 years of hands-on experience in Die Bond and/or Wire Bond process and equipment support within semiconductor backend manufacturing.

Strong understanding of R2R assembly lines and high-volume production environments.

Hands-on experience in equipment setup, calibration, troubleshooting, and optimization.

Knowledge of DOE, FMEA, SPC, 8D, and structured problem-solving methods.

Ability to analyze manufacturing data using Excel, Spotfire, Power BI, or similar tools.

Solid understanding of OEE, yield improvement, and process capability (Cpk).

Experience supporting NPI, product conversion, and material qualification.

Strong communication and cross-functional collaboration skills.

Self-motivated, detail-oriented, and able to thrive in a fast-paced manufacturing environment.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.