Group Leader – Wet Etching (TGV & Cu)

Job/Position Summary

The Group Leader – Wet Etching (TGV & Cu) is responsible for leading development, optimization, qualification, and manufacturing support activities for wet etching processes used in glass panel semiconductor manufacturing. The role focuses on achieving robust Through Glass Via (TGV) and copper etching performance with emphasis on profile control, dimensional accuracy, defect reduction, process stability, and high manufacturing yield.

This position plays a key leadership role in establishing scalable wet etching technologies for advanced packaging and glass substrate integration while managing cross-functional engineering activities and driving continuous process improvements.

Primary Responsibilities

Lead development and optimization of wet etching processes for TGV formation, copper patterning, seed layer etching, and advanced panel-level packaging applications.

Mentor and guide process engineers and technicians while driving technical excellence, process discipline, and continuous learning within the wet etching organization.

Define and control critical process parameters, including etchant chemistry concentration, temperature, spray pressure, conveyor speed, loading factor, etch rate, and process uniformity.

Own and improve wet etching process performance with focus on etch profile control, dimensional accuracy, surface quality, defect reduction, and process robustness.

Lead root cause analysis and corrective actions for defects, including undercut, over-etch, non-uniform etching, residue formation, glass damage, copper loss, surface staining, and contamination-related failures.

Drive process qualification, DOE execution, process characterization, and recipe optimization for new tools, chemistries, substrate materials, and process integration requirements.

Collaborate closely with cleaning, lithography, plating, and wet chemistry teams to ensure process compatibility, defect control, and stable manufacturing performance.

Support pilot line and high-volume manufacturing ramp activities with emphasis on yield improvement, throughput enhancement, cycle time reduction, and process stability.

Own equipment process qualification activities, including SAT, IQ/OQ/PQ, process acceptance, and production release for wet etching tools.

Requirements

Engineering degree in Chemical Engineering, Materials Science, Chemistry, Metallurgy, or related field required.

8 – 12 years of experience in semiconductor wet etching, TGV processing, copper etching, or advanced packaging technologies.

Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently. Or if currently in India, will require relocation to Bhubaneswar, Odisha.

Knowledge, Skills, and Abilities

Strong understanding of glass etching chemistries, copper wet etching processes, etch profile control, contamination control, and wet process integration.

Experience with SPC, DOE, FMEA, process characterization, yield analysis, and advanced troubleshooting methodologies.

Strong experience in panel-level packaging, glass substrate processing, or advanced semiconductor manufacturing is highly preferred.

Prior leadership experience managing engineers, technicians, or cross-functional project teams is preferred.

Physical/Working Requirements

Must be able to wear personal protective gear most of the day (where applicable).

Prolonged periods of sitting or standing.

Behavioral Traits

Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.

A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.

The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.