Hardware intern 2027: advanced packaging

At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world. You will be using laser assisted bonding (LAB) and laser assisted reflow (LAR) to explore new advanced soldering techniques. Furthermore, you will be testing the solder constellations in different package variations for warpage, solder joint quality and solder bonding strength. Tests will be run over a very wide temperature range. Candidate for this role is required to have the following expertise: Studies in EE, Physics,Mechanical Engineering, or a related discipline. Proficient in SMT assembly processes. PCB and/or laminate design and stackups. Efficient definition of experiments and their evaluation. Openess and interest to do something innovative new with new tools. Candidate for this role would also benefits from the following expertise: Advanced studies in EE, physics and mechanical engineering. Deep knowledge of SMT assembly processes. Laser soldering experience. Detailed knowledge of soldering alloys. Modelling knowledge for mechanical warpage and in=package stress. United States Infrastructure & Technology Internship Yorktown Heights, US (0147) International Business Machines Corporation