Foth
Lead Packaging Systems Engineer
Green Bay, Wisconsin · Atlanta, Georgia · Cincinnati, Ohio · Jacksonville, Florida · Austin, Texas
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hirly's read of this role
- Seniority
- Lead / management
- Stated salary
- $90,000 – $140,000 per year
- Country
- US
- Work mode
- Remote-friendly
- First seen by hirly
- 25 Sept 2026
Derived automatically from the posting. Upload your resume above to see how the role scores against it.
the posting
Foth is a 100% member-owned science and engineering consulting firm headquartered in Wisconsin, with over 85 years of success. Our 750 members across 33 locations are dedicated to solving our clients’ toughest science and engineering challenges . Consistently ranked by Engineering News Record in the top 150 firms, we offer a values-based, collaborative, and flexible work environment with professional growth opportunities. If you thrive working alongside a smart and caring team, Foth may be the place for you.
Join our team and experience the Foth difference that contributes to our impressive 92+% member retention rate ! Learn more at foth.com/careers .
At Foth , we are dedicated to providing innovative engineering solutions that drive success for our clients. We are currently seeking a highly skilled and experienced Lead Packaging Systems Engineer- Paper/General Industry to join our team. In this role, you will lead and support the mechanical design efforts on paper converting and packaging systems projects, ensuring the execution of capital projects within defined scopes, costs, and schedules. Your expertise will be crucial in developing concepts, preparing detailed design packages, and interfacing with clients and vendors. If you are passionate about engineering excellence and thrive in a collaborative environment, we invite you to consider Foth!
Listed on hirly, a job board. hirly is not the employer: Foth is hiring for this role.
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