Panel Packaging Technology Enablement Director

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Salary:

$176,000.00 - $242,000.00

Location:

Austin,TX, Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .

Applied Materials is building the equipment, process, and integration capability that makes panel-level packaging a production-ready scaling path for AI accelerators and high-performance computing. The Director, Panel Packaging Technology Enablement leads the team that develops and validates panel process solutions, from core substrate formation through build-up and interconnect. The role combines technical leadership of panel integration programs, direct engagement with customers and ecosystem partners, and management of a multidisciplinary engineering team. The Director sets the technical direction for panel enablement within the business unit and represents Applied Materials across the substrate, OSAT, foundry, and materials ecosystem.

Key Responsibilities

Technology Development and Integration

• •Defines and executes the panel technology enablement roadmap, translating AI package architecture requirements (package size, I/O density, power delivery, warpage, and reliability) into unit process and integration targets for panel technology. Plans integrated process flows spanning core formation, through-glass via fabrication and metallization, fine-line RDL and build-up layers, and panel-scale interconnect.
• •Leads the most complex integration programs from concept through customer transfer, including customized process development. Originates, designs, and analyzes engineering experiments within safety guidelines, using DOE and statistical methods to establish process windows and resolve root cause on multi-process integration issues.
• •Identifies gaps in the Applied portfolio and provides direct feedback to business unit and product division leaders on process and hardware improvements needed to meet customer roadmaps. Drives coordination across product divisions so panel solutions are delivered as integrated packages rather than individual tools.

Customer Engagement

• •Serves as the primary technical lead to strategic customers on panel packaging, including substrate manufacturers, OSATs, foundries, and accelerator designers. Positions new Applied technologies, negotiates process specifications and service offerings, and owns delivery of solutions that address high-value customer problems.
• •Establishes and oversees joint development programs, evaluations, and beta-site activities at customer development and manufacturing sites. Defines demo conditions, reviews results, and ensures learnings are captured and applied across the portfolio.
• •Makes executive-level presentations to customer and partner leadership. Works with account teams to strengthen customer satisfaction and Applied’s technical standing in advanced packaging.

Industry Collaboration and Ecosystem Development

• •Builds and manages strategic partnerships with materials suppliers, substrate makers, equipment partners, research institutes, and universities to close ecosystem gaps in panel processing, including glass handling, panel-scale metrology, materials compatibility, and standardization of panel formats.
• •Represents Applied Materials on industry consortia, standards bodies, and technical committees. Publishes and presents at leading packaging conferences and journals, and contributes to Applied’s external voice on panel-level packaging as a scaling path for AI systems.

Team Leadership and Management

• •Builds, leads, and develops a multidisciplinary team of process, integration, and applications engineers. Sets team priorities, owns resource and budget planning, and aligns team output with business unit objectives measured by revenue growth, key customer penetration, market share, and time to market.
• •Recruits and retains strong technical talent, mentors engineers at all levels, and fosters a culture of disciplined execution, data-driven decisions, and cross-functional collaboration. Creates mechanisms to track program progress, communicate issues, and draw resources from multiple business units and functions.
• •Contributes to intellectual property strategy and leads the team in generating patents and publications in panel technology.

Qualifications

Required

• •Ph.D. in chemistry, materials science, chemical engineering, electrical engineering, physics, or a related field with 12+ years of experience in semiconductor packaging, substrate, or interconnect technology development (or M.S. with 15+ years).
• •Hands-on technical depth in advanced packaging integration, such as 2.5D/3D packaging, high-density substrates, fan-out, or build-up processing, with working knowledge of PVD, plating, etch, lithography, and dielectric processes.
• •Demonstrated record of leading engineering teams and delivering complex technology programs to customers or into high-volume manufacturing.
• •Experience presenting to and negotiating with senior customer and partner leadership.
• •Track record of patents, publications, and conference presentations.

Preferred

• •Direct experience with panel-format processing, glass core substrates, through-glass vias, or fine-line RDL at sub-5 µm line/space.
• •Familiarity with AI accelerator and HPC package architectures, including chiplet integration and HBM co-packaging.
• •Established relationships across the Asia-Pacific substrate and OSAT ecosystem and participation in industry consortia.
• •Experience managing joint development agreements and multi-party technical programs.

Competencies

Functional Knowledge: Recognized internally and externally as an expert in advanced packaging, with broad expertise in emerging panel processes, materials, and integration schemes.

Business Expertise: Influences internal and external business decisions, including partner strategy, customer roadmaps, and industry standards that affect Applied’s position in advanced packaging.

Leadership: Leads highly visible, multidisciplinary teams and programs; provides technical and organizational direction across business units.

Problem Solving: Anticipates and solves complex integration problems that lack an established solution in the industry.

Impact: Shapes business unit direction through the development of new process solutions and integrated product offerings.

Interpersonal Skills: Negotiates with senior management, customers, partners, and suppliers to influence technical and commercial decisions.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 25% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other fo