Postdoctoral Research Scientist III

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Closing Date:

12/14/2026

Type of Position:

• Researchers and Scientists
• Workstudy Position:

No

Job Type:

Fixed Duration of Project/Grant (Fixed Term)

Work Shift:

• Day Shift (United States of America)
• Sponsorship Available:

No

Institution Name:

University of Arkansas, Fayetteville Founded in 1871, the University of Arkansas is a land grant institution, classified by the Carnegie Foundation among the nation’s top 2 percent of universities with the highest level of research activity. The University of Arkansas works to advance the state and build a better world through education, research, and outreach by providing transformational opportunities and skills, fostering a welcoming climate, and nurturing creativity, discovery, and the spread of new ideas and innovations.

The University of Arkansas campus is located in Fayetteville, a welcoming community ranked as one of the best places to live in the U.S. The growing region surrounding Fayetteville is home to numerous Fortune 500 companies and one of the nation’s strongest economies. Northwest Arkansas is also quickly gaining a national reputation for its focus on the arts and overall quality of life.

As an employer, the University of Arkansas offers a vibrant work environment and a workplace culture that promotes a healthy work-life balance. The benefits package includes university contributions to health, dental, life and disability insurance, tuition waivers for employees and their families, 12 official holidays, immediate leave accrual, and a choice of retirement programs with university contributions ranging from 5 to 10% of employee salary.

Below you will find the details for the position including any supplementary documentation and questions, you should review before applying for the opening.

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Department:

• Graduate Assistants, Hourly Employees & UAPG Staff
• Department's Website:

https://uapower.group/

Summary of Job Duties:

The University of Arkansas is seeking a Postdoctoral Research Scientist III to conduct research in advanced power electronics packaging within. The successful candidate will contribute to the development of advanced power semiconductor modules and packaging technologies, with particular emphasis on wide-bandgap (WBG) and ultra-wide-bandgap (UWBG) power semiconductor devices with voltage ratings ranging from 650 V to over 10 kV.

The research will support next-generation power electronics applications, including electric transportation, renewable energy, solid-state transformers, energy storage, and other high-power-density power conversion systems.

The position will support externally funded research projects and involve collaboration with faculty, students, industry partners, semiconductor manufacturers, material and packaging suppliers, and other research organizations.

• Research Responsibilities:
• -- Conduct research in advanced power electronics packaging and power semiconductor modules.
• -- Develop and evaluate advanced power module packaging concepts and technologies through modelling, simulation, fabrication, and experimental characterization.
• -- Investigate electrical, thermal, mechanical, reliability, and manufacturability aspects of advanced power module packaging.
• -- Contribute to externally funded research projects and collaborate with faculty, students, industry partners, and other research organizations.

Regular, reliable, and non-disruptive attendance is an essential job duty, as is the ability to create and maintain collegial, harmonious working relationships with others.

Qualifications:

Minimum Qualifications:

• •Ph.D. in Electrical Engineering or a closely related field from an accredited institution of higher education, conferred by the start date of employment
• •Research experience in power module packaging or closely related power semiconductor packaging technologies
• •Experience in the design, simulation, fabrication, and/or experimental characterization of power semiconductor modules

Preferred Qualifications :

• •Experience in power module packaging materials and fabrication processes, including baseplates, substrates, die attach, soldering, sintering, wire/ribbon bonding, wire-bondless interconnects (e.g., Cu spacers and Cu clips), and encapsulation (e.g., silicone gel and direct-potting epoxy resin)
• •Experience in electrical, electromagnetic, thermal, mechanical, and Multiphysics modelling and simulation using tools such as ANSYS Q3D, Maxwell, Workbench, LTspice, or equivalent simulation tools
• •Experience in power module experimental characterization, including curve-tracer characterization, double-pulse testing (DPT), high-potential (Hi-Pot) testing, partial discharge (PD) testing, and switching performance evaluation
• •Experience in power module thermal management, reliability, failure mechanisms, and manufacturability
• •Experience and/or familiarity with commercially available power module packaging platforms and industry-standard module architectures, such as EasyPACK, HybridPACK Drive, DCM, XHP™ 2, or similar platforms
• •Experience and/or familiarity with emerging and advanced packaging concepts, such as PCB-embedded power semiconductor packaging and other high-density or integrated packaging technologies
• •Experience in advanced power semiconductor module design and packaging technologies, particularly for WBG and UWBG power semiconductor devices
• •Experience and/or familiarity in CAD design and engineering tools such as SolidWorks or equivalent
• •Experience supporting or mentoring graduate or undergraduate researchers is desirable

Knowledge, Skills, and Abilities:

• •Ability to conduct research independently and collaboratively
• •Strong analytical, organizational, interpersonal, written, and oral communication skills

Qualification Equivalencies:

Additional Information:

This position is renewable annually based on continued need for the position, availability of funding, and satisfactory job performance.

Salary Information:

• Commensurate with education and experience.
• Required Documents to Apply:

Curriculum Vitae, List of three Professional References (name, email, business title) Optional Documents:

• Proof of Veteran Status
• Recruitment Contact Information:

• Terry Bennett, HR & Curriculum Manager, [email protected]
• or
• Julie Brogan, HR Partner, [email protected]
• All application materials must be uploaded to the University of Arkansas System Career Site https://uasys.wd5.myworkdayjobs.com/UASYS

Please do not send to listed recruitment contact.

Special Instructions to Applicants:

Pre-employment Screening Requirements:

Criminal Background Check, Sex Offender Registry

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