HP Iq
Product Design Engineering Intern (Summer 2027)
San Francisco, CA
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- Seniority
- Internship
- Country
- US
- Work mode
- On-site / unstated
- First seen by hirly
- 27 Oct 2026
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the posting
Who We Are
HP IQ is HP’s new AI innovation lab. Combining startup agility with HP’s global scale, we’re building intelligent technologies that redefine how the world works, creates, and collaborates.
We’re assembling a diverse, world-class team—engineers, designers, researchers, and product minds—focused on creating an intelligent ecosystem across HP’s portfolio. Together, we’re developing intuitive, adaptive solutions that spark creativity, boost productivity, and make collaboration seamless.
We create breakthrough solutions that make complex tasks feel effortless, teamwork more natural, and ideas more impactful—always with a human-centric mindset.
By embedding AI advancements into every HP product and service, we’re expanding what’s possible for individuals, organisations, and the future of work.
Join us as we reinvent work, so people everywhere can do their best work.
About The Role
HP IQ's Hardware Design team is responsible for materializing product vision into manufacturable hardware systems. Working closely with Industrial Design, System Software, Electrical Engineering, and Manufacturing partners, this role drives the design and integration of complete hardware products from early architecture and prototype phases through production ramp. The position offers the opportunity to own the mechanical and systems integration challenges that transform concepts into shipping products.
What You Might Do
Collaborate with Industrial Design to translate product vision into mechanical design, enclosure layout, and form factor feasibility
Integrate multiple subsystems (microphone, speaker, antenna, battery, PCB, sensors, buttons) into a cohesive hardware architecture
Produce CAD models, component placement studies, and tolerance analysis to guide manufacturing
Work with contract manufacturers and vendors to validate design feasibility, manage drawing releases, and troubleshoot production issues
Participate in hands-on prototype builds, design validation, and iterative refinement across development cycles
Apply design of experiments methodology to validate material selection, assembly processes, and design assumptions
Collaborate with Electrical Engineering on PCB layout, flexible PCB integration, and component placement constraints
Define assembly processes, fixturing strategies, and datuming schemes to ensure manufacturability
Own design documentation including 2D drawings, specifications, and design rationale for internal and vendor communication
Essential Qualifications
Solid understanding of material science fundamentals including stress-strain relationships, thermal properties, and material selection rationale
Proficiency with CAD tools and component placement within constrained form factors
Familiarity with tolerance analysis, tolerance stacks, and design for manufacturability principles
Experience or demonstrated knowledge of manufacturing processes including injection molding, CNC machining, extrusion, and assembly processes
Experience with PCB design, flexible PCB, or electrical component integration
Ability to operate effectively in ambiguous, prototype-heavy environments; resourcefulness and self-direction essential
Strong communication skills with ability to partner across Industrial Design, Engineering, and Manufacturing teams
Comfort with hands-on prototyping, lab work, and iterative design refinement
Demonstrated ability to work without extensive documentation or rigid structure; thrives in startup-like, fast-moving environments
Preferred Skills
Minimum 1-2 years of hardware product design or related experience; prior internship at a consumer electronics company is preferred
Experience communicating with contract manufacturers or FATP (final assembly) partners
Exposure to design of experiments (DOE) or design validation methodologies
Portfolio demonstrating complete hardware projects from design through prototype or production
Experience with assembly process design, datuming, and fixturing
Familiarity with cross-functional product development from concept through production ramp
Hourly Pay Range: $40.00–$50.00 per hour. Actual compensation will be determined based on factors such as skills, qualifications, and experience.
2027 Internship Program Dates: May/June–August/September 2027. Final dates will be based on student schedules.
Compensation & Benefits (Full-Time Employees)
The salary range for this role is listed above. Final salary offered is based upon multiple factors including individual job-related qualifications, education, experience, knowledge and skills.
At HP IQ, we offer a competitive and comprehensive benefits package, including:
Health insurance
Dental insurance
Vision insurance
Long term/short term disability insurance
Employee assistance program
Flexible spending account
Life insurance
Generous time off policies, including;
4-12 weeks fully paid parental leave based on tenure
11 paid holidays
Additional flexible paid vacation and sick leave ( US benefits overview )
Why HP IQ?
HP IQ is HP’s new AI innovation lab, building the intelligence to empower humanity—reimagining how we work, create, and connect to shape the future of work.
- Innovative Work
- Help shape the future of intelligent computing and workplace transformation.
- Autonomy and Agility
- Work with the speed and focus of a startup, backed by HP’s scale.
- Meaningful Impact
- Build AI-powered solutions that help people and organisations thrive.
- Flexible Work Environment
- Freedom and flexibility to do your best work.
- Forward-Thinking Culture
- We learn fast, stay future-focused, and imagine what comes next—together.
Equal Opportunity Employer (EEO) Statement
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement
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