Semiconductor Packaging Engineer 

The successful applicant will be responsible for mechanical engineering, including mechanical design, assembly process development and implementation and packaging of infrared focal plane arrays, for visible and infrared sensors

Key Responsibilities :

Work in mechanical and electrical subsystems and integrate them into a larger system

Perform process related activities, such as process development and yield improvement activities.

Assemble optoelectronic components of FPAs into final device packaging including die attach, wire bonding, solder, inspect and test

Perform hands-on work on mechanical and electrical systems and components

Use hand tools to perform integration and assembly tasks in a laboratory environment

Set up and operate test equipment to verify, evaluate, and troubleshoot systems and components

Perform electrical characterization of components and integrated assemblies

Design fixturing , assembly aids, and support equipment

Read, understand and utilize engineering documentation including: drawings, assembly/process instructions, block diagrams, schematic diagrams, and bills of material

Provide data analysis and status reporting to technical staff and leadership

Support maintenance of lab instrumentation

Desired Qualifications :

Experience in a laboratory or manufacturing environment involving assembly, integration, test and troubleshooting of visible and IR cameras and FPAs

Experience with optoelectronic packaging technology and integration techniques

Understanding and application of basic electrical and mechanical engineering concepts

Ability to function safely in a laboratory environment performing assembly, integration, test, and troubleshooting tasks

Ability to follow formal and informal assembly and integration processes

Proficiency with Microsoft Office tools (Word, Excel, and PowerPoint) and ability to create charts and communicate clearly

Experience with AutoCAD design , SolidWorks or other design software

Possess problem solving skills, good mechanical aptitude, strong organizational skills, and the ability to work effectively with others and individually

Understanding of mechanical and electrical assembly techniques

Exceptional time management and organizational skills

Strong oral and written communication skills with a strong attention to detail, and excellent documentation capability

Candidate should be enthusiastic and highly self-motivated

Ability to adapt to a flexible and changing schedule

Success Metrics:

Mechanical designs released on time and without errors

Fixture/tooling designs completed on schedule

Assembly process development milestones completed

Packaging process documentation completed

Documentation quality

Demonstrate good lab safety, cleanroom and ESD rule compliance