Senior Engineer

Job Summary

We are seeking a highly motivated Senior Engineer to join the RTR team. The successful candidate will be responsible for leading equipment restoration activities, major equipment repair and recovery projects, and continuous improvement initiatives within semiconductor assembly operations. The role will focus on supporting critical manufacturing processes including Die Bond, Wire Bond, and Buffer operations, while driving equipment reliability, uptime improvement, and technical competency development of floor technicians.

Key Responsibilities

Lead and coordinate major equipment restoration, repair, and recovery activities for Die Bond, Wire Bond, and Buffer process equipment.

Drive equipment reliability and uptime improvement initiatives to support manufacturing output and quality objectives.

Perform root cause analysis (RCA) on chronic equipment issues and implement sustainable corrective and preventive actions.

Develop and optimize preventive and predictive maintenance programs for production equipment.

Plan and manage major equipment overhauls, refurbishment, upgrades, and spare parts strategies.

Provide advanced troubleshooting support for equipment-related issues in Die Bond, Wire Bond, and Buffer operations.

Drive continuous improvement projects focused on equipment performance, productivity, quality, and cost reduction.

Collaborate with Production, Process Engineering, Manufacturing, Quality, and Maintenance teams to achieve operational excellence.

Lead technician skill enhancement programs through structured training, coaching, troubleshooting guidance, and knowledge-sharing initiatives.

Establish technical competency development plans for floor technicians to strengthen troubleshooting and maintenance capabilities.

Work closely with equipment vendors and suppliers on technical support, modifications, upgrades, and improvement projects.

Ensure compliance with safety, quality, and operational standards during all maintenance and engineering activities.

Monitor and analyze equipment performance indicators and recommend improvement actions.

Requirements

Education

Bachelor's Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering, or a related field.

Experience

Minimum 5-8 years of experience in semiconductor manufacturing, equipment engineering, or maintenance engineering.

Hands-on experience supporting Die Bond, Wire Bond, and Buffer processes is highly preferred.

Proven experience in equipment restoration, major breakdown recovery, equipment troubleshooting, and maintenance management.

Experience in leading technicians and driving cross-functional improvement initiatives.

Technical Skills

Strong knowledge of semiconductor assembly equipment and manufacturing processes.

Expertise in equipment restoration, troubleshooting, and failure analysis.

Strong understanding of Die Bond, Wire Bond, and Buffer equipment operations.

Knowledge of TPM, preventive maintenance, predictive maintenance, and reliability engineering principles.

Familiarity with RCA, FMEA, SPC, DOE, and continuous improvement methodologies.

Strong project management and technical leadership capabilities.

Key Focus Areas

Equipment restoration and major down repair management.

Die Bond, Wire Bond, and Buffer equipment support.

Equipment reliability and uptime improvement.

Technician competency development and skill enhancement.

Manufacturing productivity and operational excellence.

Continuous improvement and cost optimization.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.