Senior High-Speed PCB Layout Engineer

Array Labs builds advanced radar systems to help humanity understand and respond to changes across the physical world.

We’re launching a coordinated fleet of radar satellites to create a high-resolution 3D map of the Earth – updated in real time – enabling faster, smarter decision-making for government and commercial organizations supporting disaster response, infrastructure resilience, and mission-critical geopolitical intelligence.

We design and build our satellites end-to-end, producing the world’s most advanced earth observation satellites. Our fleet will deliver unprecedented levels of accuracy, coverage, and responsiveness to power critical insights precisely where they’re needed most.

About the Job

As a Senior High-Speed PCB Layout Engineer, you will own the physical implementation of Array’s high-speed digital and mixed-signal electronics in Altium, translating schematics and performance requirements into layouts and functional designs. Your work will include component placement, constraint-driven routing, stack-up definition, return path and reference plane strategy, and partitioning between sensitive mixed-signal domains and high-speed digital interfaces.

You will partner closely with electrical design, firmware, mechanical, and test engineers to drive layout constraints, reviews, and manufacturing releases. The boards you ship will directly determine signal integrity, power integrity, noise performance, and overall system reliability in the lab and on orbit.

Responsibilities:

Own high-speed PCB layout from initial placement through manufacturing release in Altium

Define and implement stack-ups, impedance targets, length-matching constraints, and reference plane/return-path strategies for high-speed interfaces

Translate schematic intent into layouts that meet signal integrity and power integrity requirements across mixed-signal and digital domains

Partner with electrical design, firmware, mechanical, and test engineers to develop layout constraints, run reviews, and de-risk first-pass success

Drive DFM/DFT considerations with fabrication and assembly partners, including documentation and release artifacts

Basic Qualifications:

B.S. in Electrical Engineering, or a related field with 4+ years of relevant experience

Experience in PCB layout, fabrication, and release of high-speed digital and mixed-signal electronics

Excellent teamwork and communication skills

Learns new concepts rapidly, completely, and in a self-directed manner

High levels of self-motivation and personal accountability

Ability to work in a fast-paced environment under significant time constraints

Preferred Skills and Experience:

Experience designing high-speed digital and mixed-signal PCB layouts including constraint-driven routing, impedance control, and length matching

Comfort with Altium Designer for complex layout and clean manufacturing outputs; familiarity with Allegro and/or OrCAD

Experience developing PCB stack-ups and layout constraints for high-speed interfaces and dense, high-performance boards

A strong intuition for layout-driven SI/PI behavior, including return paths, reference plane strategy, via transitions, and noise coupling between domains

Experience working closely with electrical design engineers to translate schematic intent into layouts that work on the first spin

Experience with manufacturing release, DFM/DFT considerations, and collaborating with fabrication and assembly partners

Experience supporting lab bring-up and debug alongside design and test engineers, including investigating SI/PI issues observed on hardware

Familiarity with SI/PI analysis workflows and tools such as Ansys SIwave, Keysight Power Analyzer, HyperLynx, or Sigrity

Experience taking high-performance hardware from prototype through qualification and environmental testing