NVIDIA
Senior Mechanical Hardware Design Engineer, IC Product
Israel, Yokneam
hirly Pro
Get in front of the people hiring at NVIDIA
- Reach the hiring manager at NVIDIA on LinkedIn, from your own account
- hirly applies to this job for you, with unlimited applications
- A resume and cover letter written for this job, unlimited
- The hiring manager and recruiter at NVIDIA, with contact details
$49 a month · ₹1,999 for 30 days in India · cancel any time
Get past the screening software and onto a recruiter's desk
hirly rewrites your resume for this job — matching the keywords and skills in the posting, moving your most relevant experience to the top, and writing a cover letter to fit. About 30 seconds.
- Keywords matched to this posting
- Fit score before you apply
- Cover letter included
Matched against 2.9M live jobs from 210,000+ employers in 200+ countries.
Tailor my resume for this job →Apply from your AI assistant
Connect hirly to Claude or ChatGPT and ask it to apply to this job. hirly tailors your resume, fills the employer’s form and asks before sending.
Some employer sites stop an application at a CAPTCHA or sign-in and hand it back with a link. Applying needs a paid plan. Works with any assistant that supports MCP.
hirly's read of this role
- Seniority
- Senior
- Country
- IL
- Work mode
- On-site / unstated
- First seen by hirly
- 8 Nov 2026
Derived automatically from the posting. Upload your resume above to see how the role scores against it.
the posting
NVIDIA is looking for a HW Mechanical Engineer to join the IC Product Engineering HW team. You will lead the mechanical design and execution of test hardware for NVIDIA’s networking and CPO (Co-Packaged Optics) products: test boards, sockets, handler interfaces, system-level test (SLT) mechanical interfaces, and HTOL platforms.
NVIDIA’s Networking division is a leading supplier of end-to-end InfiniBand and Ethernet connectivity solutions for data centers, including adapter cards, switches, cables and software. Our products deliver industry-leading bandwidth, performance and scalability. The IC PE HW team ensures these products are tested and qualified for high-volume production.
What you’ll be doing:
- Design, define and qualify test sockets, contactors, handler change kits and thermal solutions for high-power, high-speed devices, with full ownership of the mechanical specification, mechanical component selection, and mechanical constraints for board layout (keep-out zones, placement, stiffening). Manage the external vendors who supply them, including drawing reviews and design sign-off.
- Lead lab bring-up and debug, and define the thermal and mechanical constraints of test platforms so they deploy efficiently and robustly on the production floor, while meeting high-speed signal integrity requirements.
- Work with the most advanced ATE platforms in the industry, including Teradyne UltraFLEX / UltraFLEXplus and Advantest V93K testers and probers.
- Develop mechanical interfaces for optical systems on production ATE equipment, and define new design concepts for future CPO products.
- Collaborate with R&D and Production teams: board design, system-level test, signal integrity, layout, firmware and test engineering.
- Lead HTOL (High-Temperature Operating Life) hardware platforms for reliability testing.
What we need to see:
- B.Sc. in Mechanical Engineering.
- 5+ years of experience as a Mechanical Design Engineer, with hands-on 3D CAD (Creo preferred)
- Proven ownership of projects end-to-end, with the ability to work independently and drive multiple projects and vendors in parallel.
- Understanding of digital circuits, power delivery and high-speed design constraints as they affect mechanical design.
- Strong personal skills: self-learner, multi-disciplinary, able to multitask, with excellent interpersonal skills.
Ways to stand out:
- working alongside a board design team.
- System-level understanding and familiarity with production environments (SLT and final test).
- Hands-on experience with test sockets (pogo pin, coax), ATE handlers, and thermal control (tri-temp).
- Experience with high-power, large-body BGA packages, and with thermal analysis or simulation.
- Experience with optical or fiber interfaces in a test setup.
- Experience managing external mechanical vendors and tooling suppliers, including reviewing and approving manufacturing drawings.
- Strong GD&T and tolerance stack-up skills.
- Experience with HTOL, burn-in or other reliability test hardware.
- Ability to mentor junior engineers.
Listed on hirly, a job board. hirly is not the employer: NVIDIA is hiring for this role.
Similar jobs
- Senior Hardware Design EngineerIntel · Israel, Petah-TikvaFirst seen 34d ago
- Senior ASIC Design EngineerAsteralabs · Haifa District, IsraelFirst seen 7d ago
- Senior RF System & Design EngineerD Fendsolutions · Raanana, Center DistrictFirst seen 17d ago
- Senior Chip Design Engineer , GravitonAmazon · Haifa, Haifa, ISRFirst seen 33d ago
- ASIC Board Design Engineer — Cisco Silicon OneCisco · Caesarea, IsraelFirst seen today
Browse similar roles
Want this one?
Upload your resume and hirly rewrites it for this job and writes the cover letter — in about thirty seconds, before you sign up.
Tailor my resume for this job