Silicon Photonic Package Reliability and Qualification Engineer

Position Overview

We are seeking a Package Reliability and Qualification Engineer to join our Silicon Photonic Packaging team within the Optics Supply Chain organization. In this role, you will direct the reliability assessment and qualification of advanced optical engine packages. You will collaborate closely with internal design, package integration, and process engineering teams, as well as leading OSAT partners. Together, you will advance the development of robust optical packaging solutions from early-stage conceptualization through rigorous final qualification, ensuring they meet strict reliability standards for integration into our broad optical transceiver portfolio.

Key Responsibilities

• •Qualification Execution: Define, execute, and own comprehensive reliability assessment and qualification plans for advanced silicon photonic optical engine packages, including complex architectures (e.g., flip-chip, 2.5D, and 3D integrated solutions).
• •Cross-Functional Collaboration: Partner with design, package integration, and process engineering teams to identify thermomechanical, optical, and electrical failure modes early in the development cycle and drive robust corrective actions.
• •Failure Analysis (FA): Lead root-cause analysis on reliability test failures and field returns utilizing advanced metrology, optical testing, and material characterization techniques tailored to silicon photonic packaging.
• •Module Integration Support: Ensure optical engine reliability aligns strictly with system-level requirements to guarantee successful integration into pluggable optical modules.

Minimum Qualifications

• •Education: M.S. degree in Physics, Electrical Engineering, Materials Science, or a related technical discipline.
• •Experience: 5+ years of experience in semiconductor backend packaging reliability, qualification, or failure analysis.
• •Technical Knowledge: Strong understanding of advanced packaging technologies (e.g., Flip-Chip, Wafer-Level Packaging, 2.5D/3D IC).
• •Standards Expertise: Proven experience working with industry reliability standards such as JEDEC, IPC, and Telcordia (e.g., GR-468).
• •Analytical Skills: Hands-on experience with standard Failure Analysis (FA) techniques (e.g., SAT, X-ray, cross-sectioning, SEM, EDX).

Preferred Qualifications

• •Education: Ph.D. in a related engineering field with a focus on electronic or optical packaging.
• •Domain Expertise: Direct experience with Silicon Photonics (SiPh) , optical transceivers, fiber coupling, or laser packaging.
• •Simulation Skills: Knowledge of thermomechanical simulation tools (e.g., ANSYS FEA) for stress and warpage analysis.
• •Soft Skills: Strong cross-functional communication skills with a track record of successfully managing technical deliverables with global OSAT vendors.

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