IBM
Silicon Technology Research and Development Hardware Engineering Intern 2027
Albany, United States
hirly Pro
Get in front of the people hiring at IBM
- Reach the hiring manager at IBM on LinkedIn, from your own account
- hirly applies to this job for you, with unlimited applications
- A resume and cover letter written for this job, unlimited
- The hiring manager and recruiter at IBM, with contact details
$49 a month · ₹1,999 for 30 days in India · cancel any time
Get past the screening software and onto a recruiter's desk
hirly rewrites your resume for this job — matching the keywords and skills in the posting, moving your most relevant experience to the top, and writing a cover letter to fit. About 30 seconds.
- Keywords matched to this posting
- Fit score before you apply
- Cover letter included
Matched against 3M live jobs from 220,000+ employers in 200+ countries.
Tailor my resume for this job →Apply from your AI assistant
Connect hirly to Claude or ChatGPT and ask it to apply to this job. hirly tailors your resume, fills the employer’s form and asks before sending.
Some employer sites stop an application at a CAPTCHA or sign-in and hand it back with a link. Applying needs a paid plan. Works with any assistant that supports MCP.
hirly's read of this role
- Seniority
- Internship
- Country
- US
- Work mode
- On-site / unstated
- First seen by hirly
- 27 Sept 2026
Derived automatically from the posting. Upload your resume above to see how the role scores against it.
the posting
IBM Research is seeking intern candidates who want to apply their classroom learnings to real world challenges. As a Hardware Engineer Intern in semiconductor research, you will work with world-class global researchers focused on enabling next-generation chips and systems that support the tremendous processing power and unprecedented speeds required for next generation logic/memory technology and support applications such as quantum silicon and artificial intelligence. In this role, you will investigate the feasibility of applying science and engineering principles towards innovative, new hardware design and applications from state-of-the-art chip architecture, design, fabrication and test to advanced chip packaging. Background knowledge of engineering disciplines, computer science, physics, or materials science are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions to groundbreaking hardware engineering projects. Electrical engineering/Mechanical Engineering/Computer Science/Materials Engineering/Physics/Chemistry Semiconductor fabrication knowledge and/or coursework. United States Infrastructure & Technology Internship Albany, US Albany (0147) International Business Machines Corporation Chemistry Computer Science Electrical Engineering Engineering Mechanical Engineering Physics Research and Development Silicon Hardware Technology Fabrication Materials Engineering
Listed on hirly, a job board. hirly is not the employer: IBM is hiring for this role.
Similar jobs
- Application Engineering InternSelinc · 2 LocationsFirst seen today
- Materials Engineering InternRollsroyce · IndianapolisFirst seen today
- Project Engineering Intern (Civil)Rollsroyce · IndianapolisFirst seen today
- Wireless Hardware Engineering InternHpe · San Jose, California, United States of AmericaFirst seen today
- Systems Engineering Intern (Summer 2027), SAOC, Cedar Rapids, IA (Onsite)Globalhr · US-IA-CEDAR RAPIDS-143 ~ 855 35Th St NE ~ BLDG 143First seen today
Browse similar roles
Want this one?
Upload your resume and hirly rewrites it for this job and writes the cover letter — in about thirty seconds, before you sign up.
Tailor my resume for this job