Sr. Field Applications Engineer - Power Delivery

Sr. Field Applications Engineer - Power Delivery

About Us

Powerlattice is a well-funded semiconductor startup backed by leading Silicon Valley venture capital firms. We are developing a groundbreaking chiplet solution for a fundamental shift in how high-performance chips are powered, paving the way for the next generation of AI and advanced computing. We are the first to offer a tiny device that can be integrated into a SoC package.

About the Role

We are seeking a Sr. Field Applications Engineer (FAE) to support customers adopting Powerlattice’s chiplet-based power delivery network (PDN) solution. This role sits at the intersection of deep technical expertise and customer engagement, serving as a critical bridge between our internal design teams and tier-one customers.

The ideal candidate is highly organized, proactive, and articulate, with the technical credibility to partner directly with customer engineering teams working on the most advanced xPU SoCs in the industry. This role offers significant opportunity for impact, ownership, and growth, contributing directly to both customer product success and Powerlattice’s commercial momentum.

This position is well suited for someone who thrives in a fast-paced startup environment, anticipates needs before they arise, and enjoys being a trusted technical advisor to customers and internal teams alike.

Key Responsibilities

Enable customers to design GPU/CPU SoC power solution with Powerlattice’s chiplet

Assist customer’s PDN design optimization using Powerlattice’s design kit

Gather customer feedback and translate insights into improvements for customer enablement and product development

Assist customers through the full adoption lifecycle, from early modeling through physical design and system bring-up

Maintain strict confidentiality and handle sensitive technical information with discretion

Act as a primary technical point of contact for tier-one customers

Qualifications

This role is Hybrid requiring 3 days a week onsite at either our Chandler, AZ (Greater Phoenix) office or San Jose, CA.

5+ years of experience in power integrity and/or signal integrity for high-performance SoCs

Experience with package-level power integrity and signal integrity, including motherboard, substrates, interposers, and advanced packaging (2.5D / 3D)

Strong debugging skills to reproduce and resolve technical issues

Excellent written and verbal communication skills, with the ability to engage directly with customer engineering teams

High level of professionalism, discretion, and sound technical judgment

Comfortable working independently and proactively solving problems

Bonus Points

Working experience at major processor or ASIC companies in the related technical area

Proven experience as engineering or project lead in a related technical area

Hands-on experience with electrical test methodologies and instrumentation for power or signal integrity

Experience in advanced package technologies, e.g. CoWoS, 2.5D.5D

Compensation & Benefits

Anticipated annual base salary for Member of Technical Staff: $150,000 - $225,000

Stock option grant

Comprehensive benefits package including health, dental, vision, and 401(k)