Intel
3DIC Platform Wet and Plating Development Manager
US, Oregon, Hillsboro
Get past the screening software and onto a recruiter's desk
hirly rewrites your resume for this job — matching the keywords and skills in the posting, moving your most relevant experience to the top, and writing a cover letter to fit. About 30 seconds.
- Keywords matched to this posting
- Fit score before you apply
- Cover letter included
Apply from your AI assistant
Connect hirly to Claude and ask it to apply to this job. hirly tailors your resume, fills the employer’s form and asks before sending. ChatGPT: manual setup today.
Some employer sites stop an application at a CAPTCHA or sign-in and hand it back with a link. Applying needs a paid plan. Works with any assistant that supports MCP.
hirly's read of this role
- Role family
- Engineering management
- Seniority
- Lead / management
- Stated salary
- $180,770 per year
- Country
- US
- Work mode
- On-site / unstated
- First seen by hirly
- 9 Oct 2026
Derived automatically from the posting. Upload your resume above to see how the role scores against it.
the posting
Job Details:
Job Description:
Intel Foundry is seeking an exceptional Wet and Plating Module Development Manager to lead our Wet Etch/Clean as well as Plating technology development for 3DIC platform. This role will drive the development and implementation of Wet Clean/Plating processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in Wet and Plating system optimization. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.
Key Responsibilities
- Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment
- Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging
- Oversee development of production-worthy wet etch/plating processes for high-volume manufacturing
- Foster talent development for critical technical roles, and drive technical excellence and innovation within the wet etch(clean)/plating team
- Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams
- Drive Wet Etch(clean) and Plating module and segment related yield improvement initiatives and defect reduction programs
- Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing
The candidate should exhibit the following behavioral traits:
- Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.
- Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Master or PhD degree in Chemistry, Materials Science, Physics, Electrical Engineering, Mechanical Engineering, or a related field, with 8+ years of relevant experience at a Master's degree, 6+ years or experience with a PhD degree.
- The experience listed above should include a combination of the following qualifications:
- Wet Etch/Clean or Plating experience and hands-on experience working with various wet etch and/or plating platforms.
- Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.
Preferred Qualifications
- Build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.
- Rich experience with vendor relations, including material quality assessments and performance management.
- Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .
Annual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Listed on hirly, a job board. hirly is not the employer: Intel is hiring for this role.
Similar jobs
- Senior Data Center Facilities Development ManagerOracle · MI, United StatesFirst seen today
- Software Development Manager, AWS SDKs and ToolsAmazon · New York, New York, USAFirst seen today
- Software Development Manager, Amazon Product Catalog, Contribution and Item PipelinesAmazon · Sunnyvale, California, USAFirst seen today
- Client Development Manager, Manufacturing and Distribution PracticeThe Alexander Group, Inc · Chicago, ILFirst seen today
- Client Development Manager, Financial Services PracticeThe Alexander Group, Inc · Chicago, ILFirst seen today
Browse similar roles
Want this one?
Upload your resume and hirly rewrites it for this job and writes the cover letter — in about thirty seconds, before you sign up.
Tailor my resume for this job