College Intern - GT Indigo Inter-Die Gapfill Process and Integration for 3DIC

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .

• Job Description
• Position Summary
• The Process Engineer Intern will support the development, characterization, and optimization of thin film deposition processes for advanced semiconductor packaging applications. The intern will work closely with process, hardware, and materials engineers to conduct experiments, analyze data, and contribute to new technology development for next-generation semiconductor devices.
• This internship provides hands-on exposure to semiconductor manufacturing equipment, process development methodologies, statistical data analysis, and advanced packaging technologies.

• Key Responsibilities
• Process Development
• Assist engineers in designing and executing process engineering experiments.
• Support development and optimization of CVD, PECVD, PEALD, or related thin film deposition processes.
• Perform wafer processing and experimental runs according to defined procedures.
• Analyze process results and identify opportunities for performance improvement.
• Characterization & Data Analysis
• Collect and analyze process and metrology data.
• Characterize film properties including:
• Thickness
• Uniformity
• Refractive Index
• Stress
• Composition
• Surface Roughness
• Electrical Properties
• Utilize statistical methods and data visualization tools to identify trends and correlations.
• Film characterization and integration test on AMAT internal test vehicle
• Problem Solving
• Support troubleshooting of process and equipment-related issues.
• Participate in structured root cause analysis activities.
• Document findings and propose corrective actions.
• Documentation & Communication
• Maintain accurate experimental records and engineering logs.
• Prepare technical reports and presentations summarizing findings.
• Present project progress and final internship results to engineering leadership.
• Cross-Functional Collaboration
• Work with Process, Hardware, Manufacturing, and Product Engineering teams.
• Participate in technical discussions and project review meetings.
• Support customer-focused development activities where appropriate.
• Preferred Project Areas
• Depending on business priorities, interns may be assigned projects related to:
• Low-temperature dielectric deposition
• Advanced packaging materials development
• Wafer bonding process optimization
• Gap fill process development
• Film characterization and metrology correlation
• Process hardware characterization
• Process automation and data analytics
• AI-assisted process optimization

• Preferred Qualifications
• Knowledge of semiconductor manufacturing processes.
• Basic understanding of thin film deposition, plasma processing, or surface science.
• Experience with experimental design and data analysis.
• Strong problem-solving and analytical skills.
• Effective verbal and written communication skills.
• Ability to work independently and collaboratively in a team environment.
• Learning Outcomes
• By the end of the internship, the intern will gain experience in:
• Semiconductor process development methodology
• Advanced packaging technologies
• Experimental design and DOE execution
• Thin film characterization techniques
• Engineering problem solving and root cause analysis
• Technical presentation and communication skills
• Working in a global semiconductor equipment company

Additional Information

Time Type:

Full time

Employee Type:

Intern / Student

Travel:

No

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.