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European Semiconductor Manufacturing Company

Failure Analysis Engineer – Microscopy & Materials (m/f/d)

Dresden, Sachsen, Germany

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Role family
Engineering
Seniority
Mid level
Country
DE
Work mode
On-site / unstated
First seen by hirly
1 Oct 2026

Derived automatically from the posting. Upload your resume above to see how the role scores against it.

the posting

  • About us Die European Semiconductor Manufacturing Company (ESMC) ist
  • ein Joint Venture von vier Technologieführern: TSMC, Bosch, Infineon
  • und NXP, um eine hochmoderne Halbleiterfabrik im Herzen Europas zu
  • errichten. ESMC steht für unser gemeinsames Engagement zur Stärkung
  • des europäischen Halbleiter-Ökosystems. Um uns beim Aufbau unserer
  • zukünftigen Fabrik in Dresden zu unterstützen, suchen wir einen hoch
  • motivierten und leidenschaftlichen Mitarbeiter (m/w/d): Failure
  • Analysis Manager – Microscopy & Materials (m/f/d) Are you passionate
  • about investigating the microscopic root causes of complex technical
  • challenges? As a Failure Analysis Engineer (m/f/d) at ESMC, you will
  • be the lead detective of our semiconductor fabrication facility in
  • Dresden. *Starting on January 2027*, you will drive the exciting
  • greenfield setup of our brand-new local FA laboratory – overseeing
  • the move-in, installation, and qualification of cutting-edge
  • analytical equipment. Once operational, you will run advanced electron
  • microscopes to analyze defect samples, support production tool
  • qualifications, and troubleshoot process issues. This is a unique
  • opportunity to blend high-level material science with practical,
  • hands-on diagnostics to maximize the reliability of our products!
  • Tasks Lab Establishment: Lead the physical setup of the local Dresden
  • FA Lab, including the installation, qualification, and initial
  • calibration of advanced analytical instruments. Physical Failure
  • Analysis: Apply hands-on expertise using advanced microscopy and
  • sputtering systems (including TEM, SEM, and FIB) to perform
  • high-resolution sample characterization. Root-Cause Investigation:
  • Support fab engineers in diagnosing defect, yield, and reliability
  • failures by providing timely, high-quality sample analyses. Team
  • Coordination: Train and functionally guide FA lab technicians in
  • running routine sample preparation, standard monitoring, and
  • continuous improvement tasks. Process Improvement: Build and document
  • specialized local knowledge regarding material structures, defect
  • physics, and packaging failure mechanisms. Production Continuity:
  • Deliver on-duty laboratory coverage during holidays and occasional
  • planned weekend overtime (approximately once per month) to support
  • critical production issues. Profile Must-Have: Education: Bachelor’s
  • or Master’s degree in Material Science, Physics, Nanotechnology,
  • Electrical/Chemical Engineering, or a related scientific discipline.
  • Hands-on Experience: Minimum of 1 year of practical experience
  • operating advanced microscopy tools (such as SEM, TEM, or FIB). Note:
  • Relevant master's thesis work, university research projects, or
  • internships will be fully considered for ambitious fresh graduates.
  • Problem-Solving Mindset: A structured, detail-oriented approach to
  • analysis with a passion for troubleshooting and technical forensics.
  • Languages: Fluency in English (written and spoken) is required.
  • Flexibility: Adaptability to evolving tasks in a dynamic
  • startup/greenfield environment, and a readiness to support occasional
  • weekend/holiday standby shifts. Nice to have: Prior experience in
  • semiconductor failure analysis, wafer manufacturing, or cleanroom
  • environments. Knowledge of basic chemistry/etching processes for
  • physical sample preparation. Basic communication skills in German
  • and/or Mandarin. What we offer Help build a completely new
  • semiconductor manufacturing site in Europe. Work in a highly
  • international environment with colleagues across Europe, Taiwan and
  • the US. Shape processes instead of maintaining existing structures.
  • Participate in global projects and cross-functional collaboration.
  • International onboarding including 3–6 months of training in Taiwan.
  • Jede Reise beginnt mit dem ersten Schritt. Der Einstieg bei ESMC zu
  • diesem frühen Zeitpunkt bietet Ihnen die einmalige Chance, die
  • Zukunft der Fab in Dresden aktiv mitzugestalten, Ihre Karriere
  • voranzutreiben und Ihr wahres Potenzial unter Beweis zu stellen. Sie
  • arbeiten in einer schnelllebigen, internationalen Startup-Umgebung und
  • haben gleichzeitig Zugang zu den Erfahrungen, Talenten und Ressourcen
  • des größten und fortschrittlichsten Halbleiterherstellers der Welt,
  • TSMC. Sie haben vielfältige Möglichkeiten, sowohl in Taiwan als auch
  • an anderen Standorten auf der ganzen Welt etwas über den Betrieb von
  • TSMC, die digitale Transformation und verschiedene Themen im
  • Zusammenhang mit fortschrittlichen Anlagen zu lernen. Contact BITTE
  • VERVOLLSTÄNDIGEN SIE IHRE BEWERBUNG UNTER FOLGENDEM LINK:
  • https://careers.tsmc.com/careers/JobDetail?jobId=15189&source=Xing&tags=esmc_xing
  • *Please apply with English resume.
Original posting on European Semiconductor Manufacturing Company's site ↗

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