hirly

Nexperia

Mold Process Development Engineer

Seremban

See how you match this job — and similar ones. Free.

Upload your resume and hirly scores it against this role at Nexperia first, then against similar open jobs, and shows where you fit and why.

PDF or DOCX, up to 12MB. No sign-up to see your matches.

Get past the screening software and onto a recruiter's desk

hirly rewrites your resume for this job — matching the keywords and skills in the posting, moving your most relevant experience to the top, and writing a cover letter to fit. About 30 seconds.

  • Keywords matched to this posting
  • Fit score before you apply
  • Cover letter included

Matched against 2.6M live jobs from 210,000+ employers in 200+ countries.

Tailor my resume for this job →

Apply from your AI assistant

Connect hirly to Claude or ChatGPT and ask it to apply to this job. hirly tailors your resume, fills the employer’s form and asks before sending.

Some employer sites stop an application at a CAPTCHA or sign-in and hand it back with a link. Applying needs a paid plan. Works with any assistant that supports MCP.

hirly's read of this role

Seniority
Mid level
Country
MY
Work mode
On-site / unstated
First seen by hirly
26 Oct 2026

Derived automatically from the posting. Upload your resume above to see how the role scores against it.

the posting

About the Role

As a Mold Process Development Engineer , you will be responsible for driving the development, characterization, and industrialization of advanced molding technologies for semiconductor packages. You will play a critical role in enabling new package platforms, improving process robustness, and supporting Nexperia's technology roadmap through innovative process solutions and technical leadership. Working closely with cross-functional and global teams, you will contribute to delivering reliable, manufacturable, and cost-effective package solutions that meet customer and business requirements.

What Will You Do?

  • Develop and characterize for new process technology.
  • Responsible to ensure technical communication and information flow within the project team and guiding technical discussions on Molding topics. Experience with other EOL processes is advantageous.
  • Conduct competitor benchmarking and technology studies to input on Nexperia package roadmap.
  • Technical input for assembly process / equipment solutions for assigned new products or platform.
  • Understand the process integration risk and come out with a risk mitigation plan.
  • Provide technical solution starting from development to establish robust package manufacturability and reliability.
  • Provide technical support on molding for both internal and external customer.
  • Demonstrate technical leadership in subject matter and drive process challenges with cross site members.

What Will You Need?

Qualifications & Experience

  • Bachelor's Degree in Engineering or a related technical discipline.
  • 1-2 years of experience in a manufacturing environment, preferably within the semiconductor industry.
  • Hands-on experience in molding backend assembly processes.
  • Experience with wire-bonded and clip-bonded package technologies is preferred.
  • Exposure to other End-of-Line (EOL) assembly processes will be an added advantage.
  • Familiarity with process development methodologies, including Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and statistical analysis techniques.

Technical Competencies

  • Strong knowledge of semiconductor assembly and molding processes.
  • Proficient in statistical analysis and quality improvement methodologies, including: DOE (Design of Experiments) SPC (Statistical Process Control) FMEA (Failure Mode and Effects Analysis) 8D Problem Solving Minitab or equivalent statistical software
  • Knowledge of Six Sigma principles and process optimization techniques.
  • Strong analytical and troubleshooting skills with a structured approach to problem-solving.
  • Ability to identify process risks and develop effective mitigation strategies.

Soft Skills

  • Excellent communication skills with strong written and verbal proficiency in English.
  • Strong interpersonal skills with the ability to collaborate effectively across diverse teams and functions.
  • Demonstrated leadership potential with the ability to influence and drive technical discussions.
  • Highly motivated, proactive, and customer-focused with a sense of urgency in resolving issues.
  • Strong teamwork, stakeholder management, and relationship-building capabilities.
  • Ability to thrive in a dynamic, fast-paced development environment while managing multiple priorities.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

Original posting on Nexperia's site ↗

Listed on hirly, a job board. hirly is not the employer: Nexperia is hiring for this role.

Browse similar roles

Want this one?

Upload your resume and hirly rewrites it for this job and writes the cover letter — in about thirty seconds, before you sign up.

Tailor my resume for this job